Adhesion and Adhesives Technology Books

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Adhesion and Adhesives Technology


Adhesion and Adhesives Technology
  • Author : Alphonsus V. Pocius
  • Publisher : Hanser Gardner Publications
  • Release : 2012
  • ISBN : 1569905118
  • Language : En, Es, Fr & De
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This book describes, in clear understandable language, the three main disciplines of adhesion technology: mechanics of the adhesive bond, chemistry of adhesives, and surface science. Some knowledge of physical and organic chemistry is assumed, but no familiarity with the science of adhesion is required. The emphasis is on understanding adhesion, how surfaces can be prepared and modified, and how adhesives can be formulated to perform a given task. Throughout the book, the author provides a broad view of the field, with a consistent style that leads the reader from one step to the next in gaining an understanding of the science.

Adhesion and Adhesives Technology


Adhesion and Adhesives Technology
  • Author : Alphonsus V. Pocius
  • Publisher : Hanser Gardner Publications
  • Release : 2002
  • ISBN : 1569903190
  • Language : En, Es, Fr & De
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This book describes, in clear, understandable language, the three main disciplines of adhesion technology:

Adhesion and Adhesives


Adhesion and Adhesives
  • Author : Anthony J. Kinloch
  • Publisher : Springer Science & Business Media
  • Release : 2012-12-06
  • ISBN : 9789401577649
  • Language : En, Es, Fr & De
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Over the last decade, or so, the growth in the use of adhesives, especially in ever more technically demanding applications, has been rapid and many major developments in the technology of adhesives have been reported. This growth has also led to attention being focused on somewhat more basic studies of the science of adhesion and adhesives, and in recent years our level of fundamental knowledge concerning the formation and mechanical performance of adhesive joints has increased dramatically. Such studies have, of course, been aided greatly by the development of the tools at the disposal of the investigators. For example, specific surface analytical techniques, such as X-ray photoelectron and secondary-ion mass spectroscopy, and the increasingly sophisticated methods of stress analysis and fracture mechanics have been put to good use in furthering our understanding of the science of adhesion and adhesives. The present book attempts to review the multidisciplined subject of adhesion and adhesives, considering both the science and technology involved in the formation and mechanical performance of adhesive joints. The author would like to thank his friends and colleagues for useful discus sions and help in the preparation of this book. I am particularly grateful to P. Cawley, J. Comyn, W. A. Lees, A. C. Roulin-Moloney, W. C. Wake, J. G. Williams and R. J. Young who have read and commented on various chapters and P. Farr for preparing the diagrams.

Adhesives Technology for Electronic Applications


Adhesives Technology for Electronic Applications
  • Author : James J. Licari
  • Publisher : William Andrew
  • Release : 2011-06-24
  • ISBN : 1437778909
  • Language : En, Es, Fr & De
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Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: • Tamper-proof adhesives for electronic security devices. • Bio-compatible adhesives for implantable medical devices. • Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). • Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals Provides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel

Progress in Adhesion and Adhesives


Progress in Adhesion and Adhesives
  • Author : K. L. Mittal
  • Publisher : John Wiley & Sons
  • Release : 2019-07-01
  • ISBN : 9781119625292
  • Language : En, Es, Fr & De
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With the ever-increasing amount of research being published, it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in many subjects representing the field of adhesion science and adhesives. Based on the success of the preceding volumes in this series “Progress in Adhesion and Adhesives”), the present volume comprises 9 review articles (averaging 50 pages each) published in Volume 6 (2018) of Reviews of Adhesion and Adhesives. The topics covered include: Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging; Influence of Silicon-Containing Compounds on Adhesives for and Adhesion to Wood and Lignocellulosic Materials; Recent Advances in Adhesively Bonded Lap Joints Having Bi-Adhesive and Modulus-Graded Bondlines; Adhesion between Compounded Elastomers; Contact Angle Measurements and Applications in Pharmaceuticals and Foods; Groups at Polyolefin Surfaces on Exposure to Oxygen or Ammonia Plasma; Surface Free Energy Determination of Powders and Particles with Pharmaceutical Applications; Understanding Wood Bonds–Going Beyond What Meets the Eye; Dispersion Adhesion Forces between Macroscopic Objects–Basic Concepts and Modelling Techniques.