Material Modeling with the Visco-Plastic Self-Consistent Approach Books

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Handbook of Materials Behavior Models


Handbook of Materials Behavior Models
  • Author : Jean Lemaître
  • Publisher : Academic Press
  • Release : 2001
  • ISBN : 9780124433410
  • Language : En, Es, Fr & De
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Continuum Scale Simulation of Engineering Materials


Continuum Scale Simulation of Engineering Materials
  • Author : Dierk Raabe
  • Publisher : John Wiley & Sons
  • Release : 2006-03-06
  • ISBN : 9783527604210
  • Language : En, Es, Fr & De
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This book fills a gap by presenting our current knowledge and understanding of continuum-based concepts behind computational methods used for microstructure and process simulation of engineering materials above the atomic scale. The volume provides an excellent overview on the different methods, comparing the different methods in terms of their respective particular weaknesses and advantages. This trains readers to identify appropriate approaches to the new challenges that emerge every day in this exciting domain. Divided into three main parts, the first is a basic overview covering fundamental key methods in the field of continuum scale materials simulation. The second one then goes on to look at applications of these methods to the prediction of microstructures, dealing with explicit simulation examples, while the third part discusses example applications in the field of process simulation. By presenting a spectrum of different computational approaches to materials, the book aims to initiate the development of corresponding virtual laboratories in the industry in which these methods are exploited. As such, it addresses graduates and undergraduates, lecturers, materials scientists and engineers, physicists, biologists, chemists, mathematicians, and mechanical engineers.

Materials with Internal Structure


Materials with Internal Structure
  • Author : Patrizia Trovalusci
  • Publisher : Springer
  • Release : 2015-10-17
  • ISBN : 9783319214948
  • Language : En, Es, Fr & De
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The book presents a series of concise papers by researchers specialized in various fields of continuum and computational mechanics and of material science. The focus is on principles and strategies for multiscale modeling and simulation of complex heterogeneous materials, with periodic or random microstructure, subjected to various types of mechanical, thermal, chemical loadings and environmental effects. A wide overview of complex behavior of materials (plasticity, damage, fracture, growth, etc.) is provided. Among various approaches, attention is given to advanced non-classical continua modeling which, provided by constitutive characterization for the internal and external actions (in particular boundary conditions), is a very powerful frame for the gross mechanical description of complex material behaviors, able to circumvent the restrictions of classical coarse–graining multiscale approaches.

Advances in Material Forming


Advances in Material Forming
  • Author : Francisco Chinesta
  • Publisher : Springer Science & Business Media
  • Release : 2007-04-19
  • ISBN : 9782287721427
  • Language : En, Es, Fr & De
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This book groups the main advances in material forming, considering different p- cesses (conventional and non-conventional) focusing in polymers, composites and metals, that are analyzed from the state of the art, describing the most significant recent advances and identifying the present challenges from the experimental, modeling and numerical points of view. Chapters include a large list of references and have been wr- ten by recognized specialists. Special emphasis is devoted to the contributions of the European Scientific Association on Material Forming (ESAFORM) during the last 10 years (1998-2007) and in particular the ones coming from its annual international conference. The first chapter includes an excellent introduction to the Esaform association (please visit www.esaform.org for further information). We hope that this book will be valuable for all the readers, and it is specially addr- sed to young researchers trying to define the state of the art or identifying the open p- blems in the different areas covered by this book.

IUTAM Symposium on Multiscale Modeling and Characterization of Elastic Inelastic Behavior of Engineering Materials


IUTAM Symposium on Multiscale Modeling and Characterization of Elastic Inelastic Behavior of Engineering Materials
  • Author : S. Ahzi
  • Publisher : Springer Science & Business Media
  • Release : 2013-04-17
  • ISBN : 9789401704830
  • Language : En, Es, Fr & De
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The papers in this proceeding are a collection of the works presented at the IUTAM symposium-Marrakech 2002 (October 20-25) which brought together scientists from various countries. These papers cover contemporary topics in multiscale modeling and characterization of materials behavior of engineering materials. They were selected to focus on topics related to deformation and failure in metals, alloys, intermetallics and polymers including: experimental techniques, deformation and failure mechanisms, dislocation-based modelling, microscopic-macroscopic averaging schemes, application to forming processes and to phase transformation, localization and failure phenomena, and computational advances. Key areas that are covered by some of the papers include modeling of material deformation at various scales. At the atomistic scale, results from MD simulations pertaining to deformation mechanisms in nano-crystalline materials as well as dislocation-defect interactions are presented. Advances in modeling of deformation in metals using discrete dislocation analyses are also presented, providing an insight into this emerging scientific technique that can be used to model deformation at the microscale. These papers address current engineering problems, including deformation of thin fIlms, dislocation behavior and strength during nanoindentation, strength in metal matrix composites, dislocation-crack interaction, development of textures in polycrystals, and problems involving twining and shape memory behavior. On Behalf of the organizing committee, I would like to thank Professor P.