New Approaches to Image Processing Based Failure Analysis of Nano-Scale ULSI Devices Books

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New Approaches to Image Processing based Failure Analysis of Nano Scale ULSI Devices


New Approaches to Image Processing based Failure Analysis of Nano Scale ULSI Devices
  • Author : Zeev Zalevsky
  • Publisher : William Andrew
  • Release : 2013-11-13
  • ISBN : 9780128000175
  • Language : En, Es, Fr & De
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New Approaches to Image Processing Based Failure Analysis of Nano-Scale ULSI Devices introduces the reader to transmission and scanning microscope image processing for metal and non-metallic microstructures. Engineers and scientists face the pressing problem in ULSI development and quality assurance: microscopy methods can’t keep pace with the continuous shrinking of feature size in microelectronics. Nanometer scale sizes are below the resolution of light, and imaging these features is nearly impossible even with electron microscopes, due to image noise. This book presents novel "smart" image processing methods, applications, and case studies concerning quality improvement of microscope images of microelectronic chips and process optimization. It explains an approach for high-resolution imaging of advanced metallization for micro- and nanoelectronics. This approach obviates the time-consuming preparation and selection of microscope measurement and sample conditions, enabling not only better electron-microscopic resolution, but also more efficient testing and quality control. This in turn leads to productivity gains in design and development of nano-scale ULSI chips. The authors also present several approaches for super-resolving low-resolution images to improve failure analysis of microelectronic chips. Acquaints users with new software-based approaches to enhance high-resolution microscope imaging of microchip structures Demonstrates how these methods lead to productivity gains in the development of ULSI chips Presents several techniques for the superresolution of images, enabling engineers and scientists to improve their results in failure analysis of microelectronic chips

Handbook of Silicon Based MEMS Materials and Technologies


Handbook of Silicon Based MEMS Materials and Technologies
  • Author : Markku Tilli
  • Publisher : William Andrew
  • Release : 2015-09-02
  • ISBN : 9780323312233
  • Language : En, Es, Fr & De
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The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures Geared towards practical applications rather than theory

Microelectronics Failure Analysis


Microelectronics Failure Analysis
  • Author :
  • Publisher : ASM International
  • Release : 2004-01-01
  • ISBN : 9780871708045
  • Language : En, Es, Fr & De
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For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron

Characterization and Metrology for ULSI Technology 2005


Characterization and Metrology for ULSI Technology 2005
  • Author : David G. Seiler
  • Publisher : American Institute of Physics
  • Release : 2005-09-29
  • ISBN : UOM:39015069190943
  • Language : En, Es, Fr & De
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The worldwide semiconductor community faces increasingly difficult challenges in the era of silicon nanotechnology and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continuing the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The book also covers emerging nano-devices and the corresponding metrology challenges that arise.

International Aerospace Abstracts


International Aerospace Abstracts
  • Author :
  • Publisher :
  • Release : 1998
  • ISBN : STANFORD:36105021108332
  • Language : En, Es, Fr & De
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