Three-Dimensional Molded Interconnect Devices Books

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Three dimensional Molded Interconnect Devices 3D MID


Three dimensional Molded Interconnect Devices  3D MID
  • Author : Jörg Franke
  • Publisher : Hanser Pub Incorporated
  • Release : 2014
  • ISBN : 1569905517
  • Language : En, Es, Fr & De
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Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MID are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MID are used in virtually every sector of electronics. The many standard applications for MID in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications, and industrial automation with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

11th International Congress Molded Interconnect Devices Scientific Proceedings


11th International Congress Molded Interconnect Devices    Scientific Proceedings
  • Author : Jörg Franke
  • Publisher : Trans Tech Publications Ltd
  • Release : 2014-09-26
  • ISBN : 9783038266365
  • Language : En, Es, Fr & De
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Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability.

Proceedings of the 6th CIRP Sponsored International Conference on Digital Enterprise Technology


Proceedings of the 6th CIRP Sponsored International Conference on Digital Enterprise Technology
  • Author : George Q. Huang
  • Publisher : Springer Science & Business Media
  • Release : 2009-12-12
  • ISBN : 3642104304
  • Language : En, Es, Fr & De
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This Proceedings volume contains articles presented at the CIRP-Sponsored Inter- tional Conference on Digital Enterprise Technology (DET2009) that takes place December 14–16, 2009 in Hong Kong. This is the 6th DET conference in the series and the first to be held in Asia. Professor Paul Maropoulos initiated, hosted and chaired the 1st International DET Conference held in 2002 at the University of D- ham. Since this inaugural first DET conference, DET conference series has been s- cessfully held in 2004 at Seattle, Washington USA, in 2006 at Setubal Portugal, in 2007 at Bath England, and in 2008 at Nantes France. The DET2009 conference continues to bring together International expertise from the academic and industrial fields, pushing forward the boundaries of research kno- edge and best practice in digital enterprise technology for design and manufacturing, and logistics and supply chain management. Over 120 papers from over 10 countries have been accepted for presentation at DET2009 and inclusion in this Proceedings volume after stringent refereeing process. On behalf of the organizing and program committees, the Editors are grateful to the many people who have made DET2009 possible: to the authors and presenters, es- cially the keynote speakers, to those who have diligently reviewed submissions, to members of International Scientific Committee, Organizing Committee and Advisory Committes, and to colleagues for their hard work in sorting out all the arrangements. We would also like to extend our gratitude to DET2009 sponsors, co-organizers, and supporting organizations.

2003 International Symposium on Microelectronics


2003 International Symposium on Microelectronics
  • Author : Ken Gilleo
  • Publisher : Society of Photo Optical
  • Release : 2003-11-01
  • ISBN : 0819451894
  • Language : En, Es, Fr & De
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Manufacturing Engineering and Automation I


Manufacturing Engineering and Automation I
  • Author : Liangchi Zhang
  • Publisher : Trans Tech Publications Ltd
  • Release : 2010-10-19
  • ISBN : 9783038133926
  • Language : En, Es, Fr & De
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This special volume brings together the latest advances in, and applications of, Manufacturing Engineering and Automation. It comprises 598 peer-reviewed papers selected from over 1000 papers submitted by universities and industrial concerns all over the world. Volume is indexed by Thomson Reuters CPCI-S (WoS).